Packaging container cardboard for accommodating electronic chips

This patent relates to a packaging container board for accommodating an electronic chip, which is suitable for a process of taking out a chip at a high speed. It includes: a base cardboard, a top cover tape. The top cover tape is thermally bonded to the front side of the base paperboard by two strips of width 0.5+/-0.15mxd; a bottom cover tape, and the packaging container board is also provided with a plurality of chips Packaging holes and sprocket holes, wherein the centerline average roughness (Ra) of the front side of the base paperboard is 2.5 to 4.9 μm, and the average peel strength between the base paperboard and the top cover tape bonded to each other is 0.1 to 0 At .6N, the signal-to-noise ratio of the peel strength is 0.40 or less.

Source: Packaging News

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